3D integration using inductive coupling and coupled resonator (Invited)

Yasuhiro Take, Junichiro Kadomoto, Tadahiro Kuroda

    研究成果: Conference contribution

    抄録

    This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

    本文言語English
    ホスト出版物のタイトル2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ46-48
    ページ数3
    ISBN(印刷版)9781467377942
    DOI
    出版ステータスPublished - 2016 1 8
    イベントIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
    継続期間: 2015 8 262015 8 28

    Other

    OtherIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
    国/地域Japan
    CitySendai
    Period15/8/2615/8/28

    ASJC Scopus subject areas

    • コンピュータ ネットワークおよび通信
    • 電子工学および電気工学

    フィンガープリント

    「3D integration using inductive coupling and coupled resonator (Invited)」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル