3D jisso technology opened-up by near-field wireless communications

Tadahiro Kuroda

研究成果: Article › 査読

本文言語	English
ページ（範囲）	231-235
ページ数	5
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	15
号	4
DOI	https://doi.org/10.5104/jiep.15.231
出版ステータス	Published - 2012 7月

ASJC Scopus subject areas

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