6W/25mm2 inductive power transfer for non-contact wafer-level testing

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

    研究成果: Conference contribution

    42 被引用数 (Scopus)

    抄録

    Wafer-level testing allows detection of manufacturing errors and removes nonfunctional devices early in the fabrication process. It is commonly performed by placing a probe card directly above a device under test (DUT) and establishing a mechanical contact between them by means of an array of probes. This is an invasive technique that may damage fragile low-k dielectric layers and deform pads or bumps. More importantly, it is very difficult to flip thinned wafers face up for probing if they were earlier positioned face down for back grinding. Additional difficulty in handling of thinned wafers arises if dies have to be flipped again for bumping. One solution to above problems is wireless probing. With a number of proposed techniques for establishing high-speed inductive-coupling data links [3] and measuring DC analog signal wirelessly [4], the largest remaining obstacle to non-contact wafer-level testing is supplying power to the DUT. This is because wireless power transfer solutions reported earlier [1,5] do not provide an output power that is sufficient for testing modern high performance devices.

    本文言語English
    ホスト出版物のタイトル2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011
    ページ230-231
    ページ数2
    DOI
    出版ステータスPublished - 2011 5 12
    イベント2011 IEEE International Solid-State Circuits Conference, ISSCC 2011 - San Francisco, CA, United States
    継続期間: 2011 2 202011 2 24

    出版物シリーズ

    名前Digest of Technical Papers - IEEE International Solid-State Circuits Conference
    ISSN(印刷版)0193-6530

    Other

    Other2011 IEEE International Solid-State Circuits Conference, ISSCC 2011
    国/地域United States
    CitySan Francisco, CA
    Period11/2/2011/2/24

    ASJC Scopus subject areas

    • 電子材料、光学材料、および磁性材料
    • 電子工学および電気工学

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