80-Gbit/s MCM-C technologies for high-speed ATM switching systems

Katsuhiko Okazaki; Nobuaki Sugiura; Akio Harada; Naoaki Yamanaka; Eiji Oki

80-Gbit/s MCM-C technologies for high-speed ATM switching systems

Katsuhiko Okazaki, Nobuaki Sugiura, Akio Harada, Naoaki Yamanaka, Eiji Oki

研究成果: Conference article › 査読

抄録

We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.

本文言語	English
ページ（範囲）	284-288
ページ数	5
ジャーナル	Proceedings of SPIE - The International Society for Optical Engineering
巻	3830
出版ステータス	Published - 1999 12 1
外部発表	はい
イベント	Proceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA 継続期間: 1999 4 6 → 1999 4 9

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
凝縮系物理学
コンピュータサイエンスの応用
応用数学
電子工学および電気工学

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引用スタイル

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title = "80-Gbit/s MCM-C technologies for high-speed ATM switching systems",

abstract = "We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.",

author = "Katsuhiko Okazaki and Nobuaki Sugiura and Akio Harada and Naoaki Yamanaka and Eiji Oki",

year = "1999",

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journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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T1 - 80-Gbit/s MCM-C technologies for high-speed ATM switching systems

AU - Okazaki, Katsuhiko

AU - Sugiura, Nobuaki

AU - Harada, Akio

AU - Yamanaka, Naoaki

AU - Oki, Eiji

PY - 1999/12/1

Y1 - 1999/12/1

N2 - We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.

AB - We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.

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M3 - Conference article

AN - SCOPUS:0033363541

VL - 3830

SP - 284

EP - 288

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

T2 - Proceedings of the 1999 International Conference on High Density Packaging and MCMs

Y2 - 6 April 1999 through 9 April 1999

ER -

80-Gbit/s MCM-C technologies for high-speed ATM switching systems

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ASJC Scopus subject areas

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