A 0.15-mm-thick noncontact connector for mipi using a vertical directional coupler

Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda

研究成果: Article査読

7 被引用数 (Scopus)

抄録

A noncontact and housing-less thin-thick connecting method was developed for mobile industry processor interface (MIPI) applications. This paper describes the world's first 0.15-mm-thick connector using a vertical directional coupler (VDC) which enables simultaneous two-link communication with one coupler without fatal performance degradation. We have analyzed the conditions for isolating two links in a coupler, and the design method is discussed. A fully balanced pulse transmitter implemented in 90-nm CMOS technology significantly suppressed electromagnetic interference (EMI), which agrees well with MIPI requirements. An experimental liquid crystal display interface system reached a maximum data rate of 2.3 Gb/s/link at a bit error rate of less than 10-12 and a power consumption of 1.47~pJ/b. The timing margin of single link was 320 ps (=64% U.I.) and of two links was 305 ps (= 61% U.I.) at 2.0 Gb/s.

本文言語English
論文番号6616659
ページ(範囲)223-231
ページ数9
ジャーナルIEEE Journal of Solid-State Circuits
49
1
DOI
出版ステータスPublished - 2014 1月

ASJC Scopus subject areas

  • 電子工学および電気工学

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