A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

So Hasegawa, Junichiro Kadomoto, Atsutake Kosuge, Tadahiro Kuroda

研究成果: Conference contribution

抄録

An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

元の言語English
ホスト出版物のタイトルESSCIRC 2016: 42nd European Solid-State Circuits Conference
出版者IEEE Computer Society
ページ469-472
ページ数4
2016-October
ISBN(電子版)9781509029723
DOI
出版物ステータスPublished - 2016 10 18
イベント42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
継続期間: 2016 9 122016 9 15

Other

Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
Switzerland
Lausanne
期間16/9/1216/9/15

Fingerprint

Integrated circuit layout
Transceivers
Telecommunication links
Electric power utilization
Magnetic fields

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Hasegawa, S., Kadomoto, J., Kosuge, A., & Kuroda, T. (2016). A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. : ESSCIRC 2016: 42nd European Solid-State Circuits Conference (巻 2016-October, pp. 469-472). [7598343] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598343

A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. / Hasegawa, So; Kadomoto, Junichiro; Kosuge, Atsutake; Kuroda, Tadahiro.

ESSCIRC 2016: 42nd European Solid-State Circuits Conference. 巻 2016-October IEEE Computer Society, 2016. p. 469-472 7598343.

研究成果: Conference contribution

Hasegawa, S, Kadomoto, J, Kosuge, A & Kuroda, T 2016, A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. : ESSCIRC 2016: 42nd European Solid-State Circuits Conference. 巻. 2016-October, 7598343, IEEE Computer Society, pp. 469-472, 42nd European Solid-State Circuits Conference, ESSCIRC 2016, Lausanne, Switzerland, 16/9/12. https://doi.org/10.1109/ESSCIRC.2016.7598343
Hasegawa S, Kadomoto J, Kosuge A, Kuroda T. A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. : ESSCIRC 2016: 42nd European Solid-State Circuits Conference. 巻 2016-October. IEEE Computer Society. 2016. p. 469-472. 7598343 https://doi.org/10.1109/ESSCIRC.2016.7598343
Hasegawa, So ; Kadomoto, Junichiro ; Kosuge, Atsutake ; Kuroda, Tadahiro. / A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. ESSCIRC 2016: 42nd European Solid-State Circuits Conference. 巻 2016-October IEEE Computer Society, 2016. pp. 469-472
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