A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

So Hasegawa, Junichiro Kadomoto, Atsutake Kosuge, Tadahiro Kuroda

    研究成果: Conference contribution

    3 被引用数 (Scopus)

    抄録

    An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

    本文言語English
    ホスト出版物のタイトルESSCIRC 2016: 42nd European Solid-State Circuits Conference
    出版社IEEE Computer Society
    ページ469-472
    ページ数4
    2016-October
    ISBN(電子版)9781509029723
    DOI
    出版ステータスPublished - 2016 10 18
    イベント42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
    継続期間: 2016 9 122016 9 15

    Other

    Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
    国/地域Switzerland
    CityLausanne
    Period16/9/1216/9/15

    ASJC Scopus subject areas

    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

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