A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

N. Miura, D. Mizoguchi, M. Inoue, T. Sakurai, T. Kuroda

    研究成果: Article査読

    62 被引用数 (Scopus)

    抄録

    A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/ m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.

    本文言語English
    ページ(範囲)23-34
    ページ数12
    ジャーナルIEEE Journal of Solid-State Circuits
    41
    1
    DOI
    出版ステータスPublished - 2006 1

    ASJC Scopus subject areas

    • 電子工学および電気工学

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