An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.
|ジャーナル||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|出版ステータス||Published - 2005 12 6|
|イベント||2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States|
継続期間: 2005 2 6 → 2005 2 10
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering