A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

    研究成果: Conference article査読

    7 被引用数 (Scopus)

    抄録

    An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

    本文言語English
    論文番号14.5
    ページ(範囲)210-211+602
    ジャーナルDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    48
    出版ステータスPublished - 2005 12 6
    イベント2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
    継続期間: 2005 2 62005 2 10

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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