A case for wireless 3D NoCs for CMPs

Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

研究成果: Conference contribution

38 被引用数 (Scopus)

抄録

Inductive-coupling is yet another 3D integration technique that can be used to stack more than three known-good-dies in a SiP without wire connections. We present a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in a SiP after chips have been fabricated. In this paper, first, we propose a routing protocol that exchanges the network information between all chips in a given SiP to establish efficient deadlock-free routing paths. Second, we propose its optimization technique that analyzes the application traffic patterns and selects different spanning tree roots so as to minimize the average hop counts and improve the application performance.

本文言語English
ホスト出版物のタイトル2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
ページ23-28
ページ数6
DOI
出版ステータスPublished - 2013 5 20
イベント2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
継続期間: 2013 1 222013 1 25

出版物シリーズ

名前Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
国/地域Japan
CityYokohama
Period13/1/2213/1/25

ASJC Scopus subject areas

  • コンピュータ サイエンスの応用
  • コンピュータ グラフィックスおよびコンピュータ支援設計
  • 電子工学および電気工学

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