A parametric design framework to support structural and functional modeling of complex consumer electronics products

Kenichi Seki, Hidekazu Nishimura, Shaopeng Zhu, Laurent Balmelli

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.

本文言語English
ホスト出版物のタイトルICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design
ページ282-291
ページ数10
出版ステータスPublished - 2011 12 1
イベント18th International Conference on Engineering Design, ICED 11 - Copenhagen, Denmark
継続期間: 2011 8 152011 8 18

出版物シリーズ

名前ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design
6

Other

Other18th International Conference on Engineering Design, ICED 11
CountryDenmark
CityCopenhagen
Period11/8/1511/8/18

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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