A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

Noriyuki Miura; Yusuke Koizumi; Eiichi Sasaki; Yasuhiro Take; Hiroki Matsutani; Tadahiro Kuroda; Hideharu Amano; Ryuichi Sakamoto; Mitaro Namiki; Kimiyoshi Usami; Masaaki Kondo; Hiroshi Nakamura

doi:10.1109/HOTCHIPS.2013.7478328

A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura

情報工学科

研究成果: Conference contribution

抄録

Recent battery driven IT devices including smart phone and tablets require versatile functions and high performance with low energy consumption. On the other hand, the initial cost of LSI for design and mask development has increased rapidly, and development of an SoC (System-on-a Chip) for each product has become difficult. Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products. As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed. This system consists of a MIPS-R3000 compatible embedded CPU and reconfigurable accelerators. Since chips are connected with wireless inductive coupling channels, the number and types of accelerators can be tailored easily depending on the requirement of the product.

本文言語	English
ホスト出版物のタイトル	2013 IEEE Hot Chips 25 Symposium, HCS 2013
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子版）	9781467388818
DOI	https://doi.org/10.1109/HOTCHIPS.2013.7478328
出版ステータス	Published - 2013 5月 24
イベント	25th IEEE Hot Chips Symposium, HCS 2013 - Stanford, United States 継続期間: 2013 8月 25 → 2013 8月 27

出版物シリーズ

名前	2013 IEEE Hot Chips 25 Symposium, HCS 2013

Other

Other	25th IEEE Hot Chips Symposium, HCS 2013
国/地域	United States
City	Stanford
Period	13/8/25 → 13/8/27

ASJC Scopus subject areas

ハードウェアとアーキテクチャ

UN SDG

この成果は、次の持続可能な開発目標に貢献しています

文献へのアクセス

10.1109/HOTCHIPS.2013.7478328

他のファイルとリンク

引用スタイル

Miura, N., Koizumi, Y., Sasaki, E., Take, Y., Matsutani, H., Kuroda, T., Amano, H., Sakamoto, R., Namiki, M., Usami, K., Kondo, M., & Nakamura, H. (2013). A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. In 2013 IEEE Hot Chips 25 Symposium, HCS 2013 [7478328] (2013 IEEE Hot Chips 25 Symposium, HCS 2013). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HOTCHIPS.2013.7478328

Miura, N, Koizumi, Y, Sasaki, E, Take, Y, Matsutani, H, Kuroda, T, Amano, H, Sakamoto, R, Namiki, M, Usami, K, Kondo, M & Nakamura, H 2013, A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. in 2013 IEEE Hot Chips 25 Symposium, HCS 2013., 7478328, 2013 IEEE Hot Chips 25 Symposium, HCS 2013, Institute of Electrical and Electronics Engineers Inc., 25th IEEE Hot Chips Symposium, HCS 2013, Stanford, United States, 13/8/25. https://doi.org/10.1109/HOTCHIPS.2013.7478328

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AU - Kuroda, Tadahiro

AU - Amano, Hideharu

AU - Sakamoto, Ryuichi

AU - Namiki, Mitaro

AU - Usami, Kimiyoshi

AU - Kondo, Masaaki

AU - Nakamura, Hiroshi

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AB - Recent battery driven IT devices including smart phone and tablets require versatile functions and high performance with low energy consumption. On the other hand, the initial cost of LSI for design and mask development has increased rapidly, and development of an SoC (System-on-a Chip) for each product has become difficult. Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products. As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed. This system consists of a MIPS-R3000 compatible embedded CPU and reconfigurable accelerators. Since chips are connected with wireless inductive coupling channels, the number and types of accelerators can be tailored easily depending on the requirement of the product.

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A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

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出版物シリーズ

Other

ASJC Scopus subject areas

UN SDG

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