A system-level thermal design specification development of electronic products considering software changes

Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

Realizing the market demand for small size and fast processing speeds, thermal design is one of the major challenges in the development of electronic products. In addition, there are many software changes necessary to adapt to the rapid-moving trends in customer applications. Therefore it is difficult to develop a product design specification in the early stages of product development. In this study, we first introduce a typical system-level thermal design simulation method, coupling activities among modules related to software, electrical parts, and mechanical structure. In particular, this method allows us to evaluate risks related to thermal burn injury depending on the software's application. Then, we investigate this method by applying it to a design process case for electronic products that require software changes, such as having additional applications. The system-level simulation can be used to evaluate the thermal risk that may rise by the applications. We verify the design control to satisfy product quality using Systems Modeling Language (SysML) and the resulting design specification of the system architecture.

本文言語English
ホスト出版物のタイトルProceedings of the 19th International Conference on Engineering Design
ホスト出版物のサブタイトルDesign for Harmonies, ICED 2013
ページ319-328
ページ数10
1 DS75-01
出版ステータスPublished - 2013 12 1
イベント19th International Conference on Engineering Design, ICED 2013 - Seoul, Korea, Republic of
継続期間: 2013 8 192013 8 22

Other

Other19th International Conference on Engineering Design, ICED 2013
国/地域Korea, Republic of
CitySeoul
Period13/8/1913/8/22

ASJC Scopus subject areas

  • モデリングとシミュレーション
  • 工学(その他)
  • 産業および生産工学

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