The frequency drift of open-loop PLL is an issue for the direct modulation applications such as Bluetooth transceiver. The drift mainly comes from the temperature variation of the VCO during the TX operation. In this paper, we propose the optimum location of the VCO considering the temperature gradient through the full-chip thermal analysis. Moreover, a novel temperature- compensated VCO by employing a new biasing scheme is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.
|ジャーナル||Proceedings of the Custom Integrated Circuits Conference|
|出版ステータス||Published - 2004|
|イベント||Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC - Orlando, FL, United States|
継続期間: 2004 10月 3 → 2004 10月 6
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