A trial for micro-scale evaluation of adhesion strength around Cu metallization systems

Shoji Kamiya, Hitoshi Arakawa, Hiroshi Shimomura, Masaki Omiya

研究成果: Conference contribution

抜粋

Adhesion strength of the interface between Cu film and SiCN cap layer for IC metallization system was evaluated by a technique developed by the authors. In this technique, microscopic specimens with the in-plane dimension less than 10 μm were fabricated by focused ion beam system and loaded directly by a sharp diamond stylus with submicron tip radius. By comparing the crack extension behavior with the three-dimensional numerical simulation, the interface adhesion energy was evaluated to be 5 J/m2. The same interface was subjected also to the four-point bending experiment, which is widely applied to interface adhesion measurement. The evaluation results by the two techniques agreed reasonably well with each other.

元の言語English
ホスト出版物のタイトルMaterials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
出版者Materials Research Society
ページ213-218
ページ数6
ISBN(印刷物)9781558999503
DOI
出版物ステータスPublished - 2007 1 1
イベント2007 MRS Spring Meeting - San Francisco, CA, United States
継続期間: 2007 4 102007 4 12

出版物シリーズ

名前Materials Research Society Symposium Proceedings
990
ISSN(印刷物)0272-9172

Other

Other2007 MRS Spring Meeting
United States
San Francisco, CA
期間07/4/1007/4/12

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • これを引用

    Kamiya, S., Arakawa, H., Shimomura, H., & Omiya, M. (2007). A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. : Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics (pp. 213-218). (Materials Research Society Symposium Proceedings; 巻数 990). Materials Research Society. https://doi.org/10.1557/proc-0990-b10-04