A vertical bubble flow network using inductive-coupling for 3-D CMPs

Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

研究成果: Conference contribution

17 被引用数 (Scopus)

抄録

A wireless 3-D NoC architecture for CMPs, in which the number of processor and cache chips stacked in a package can be changed after the chip fabrication, is proposed by using the inductive coupling technology that can connect more than two known-good-dies without wire connections. Each chip has data transceivers for uplink and downlink in order to communicate with its neighboring chips in the package. These chips form a single vertical ring network so as to fully exploit the flexibility of the wireless approach that enables us to add, remove, and swap the chips in the ring. To avoid protocol and structural deadlocks in the ring network, we use the bubble flow control which is more flexible and efficient compared to the conventional VC-based deadlock avoidance. We implemented a real 3-D chip that has on-chip routers and inductive-coupling data transceivers using a 65nm process in order to show the feasibility of our proposal. The vertical bubble flow control is compared with the conventional VC-based approach and vertical bus in terms of the throughput, hardware amount, and application performance using a full system CMP simulator. The results show that the proposed vertical bubble flow network outperforms the VC-based approach by 7.9%-12.5% with a 33.5% smaller router area.

本文言語English
ホスト出版物のタイトルNOCS 2011
ホスト出版物のサブタイトルThe 5th ACM/IEEE International Symposium on Networks-on-Chip
ページ49-56
ページ数8
DOI
出版ステータスPublished - 2011
イベント5th ACM/IEEE International Symposium on Networks-on-Chip, NOCS 2011 - Pittsburgh, PA, United States
継続期間: 2011 5 12011 5 4

出版物シリーズ

名前NOCS 2011: The 5th ACM/IEEE International Symposium on Networks-on-Chip

Other

Other5th ACM/IEEE International Symposium on Networks-on-Chip, NOCS 2011
国/地域United States
CityPittsburgh, PA
Period11/5/111/5/4

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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