Active crosstalk cancel for high-density inductive inter-chip wireless communication

Amit Kumar, Noriyuki Miura, Muhammad Muqsith, Tadahiro Kuroda

    研究成果: Conference contribution

    3 被引用数 (Scopus)

    抄録

    A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15μm and for varying inductor pitch layout from 10μm to 50μm. Simulink simulations show that for the same Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25μm to 15μm for SNR of 15db.

    本文言語English
    ホスト出版物のタイトルProceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
    ページ271-276
    ページ数6
    DOI
    出版ステータスPublished - 2006 9 18
    イベント19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design - Hyderabad, India
    継続期間: 2006 1 32006 1 7

    出版物シリーズ

    名前Proceedings of the IEEE International Conference on VLSI Design
    2006
    ISSN(印刷版)1063-9667

    Other

    Other19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
    国/地域India
    CityHyderabad
    Period06/1/306/1/7

    ASJC Scopus subject areas

    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

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