Active crosstalk cancel for high-density inductive inter-chip wireless communication

Amit Kumar; Noriyuki Miura; Muhammad Muqsith; Tadahiro Kuroda

doi:10.1109/VLSID.2006.31

Active crosstalk cancel for high-density inductive inter-chip wireless communication

Amit Kumar, Noriyuki Miura, Muhammad Muqsith, Tadahiro Kuroda

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15μm and for varying inductor pitch layout from 10μm to 50μm. Simulink simulations show that for the same Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25μm to 15μm for SNR of 15db.

本文言語	English
ホスト出版物のタイトル	Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
ページ	271-276
ページ数	6
DOI	https://doi.org/10.1109/VLSID.2006.31
出版ステータス	Published - 2006 9月 18
イベント	19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design - Hyderabad, India 継続期間: 2006 1月 3 → 2006 1月 7

出版物シリーズ

名前	Proceedings of the IEEE International Conference on VLSI Design
巻	2006
ISSN（印刷版）	1063-9667

Other

Other	19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
国/地域	India
City	Hyderabad
Period	06/1/3 → 06/1/7

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

文献へのアクセス

10.1109/VLSID.2006.31

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引用スタイル

Kumar, A., Miura, N., Muqsith, M., & Kuroda, T. (2006). Active crosstalk cancel for high-density inductive inter-chip wireless communication. In Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design (pp. 271-276). [1581464] (Proceedings of the IEEE International Conference on VLSI Design; Vol. 2006). https://doi.org/10.1109/VLSID.2006.31

Active crosstalk cancel for high-density inductive inter-chip wireless communication. / Kumar, Amit; Miura, Noriyuki; Muqsith, Muhammad その他.

Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design. 2006. p. 271-276 1581464 (Proceedings of the IEEE International Conference on VLSI Design; Vol. 2006).

研究成果: Conference contribution

Kumar, A, Miura, N, Muqsith, M & Kuroda, T 2006, Active crosstalk cancel for high-density inductive inter-chip wireless communication. in Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design., 1581464, Proceedings of the IEEE International Conference on VLSI Design, vol. 2006, pp. 271-276, 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design, Hyderabad, India, 06/1/3. https://doi.org/10.1109/VLSID.2006.31

Kumar A, Miura N, Muqsith M, Kuroda T. Active crosstalk cancel for high-density inductive inter-chip wireless communication. In Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design. 2006. p. 271-276. 1581464. (Proceedings of the IEEE International Conference on VLSI Design). doi: 10.1109/VLSID.2006.31

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abstract = "A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15μm and for varying inductor pitch layout from 10μm to 50μm. Simulink simulations show that for the same Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25μm to 15μm for SNR of 15db.",

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Active crosstalk cancel for high-density inductive inter-chip wireless communication

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