Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji Kamiya, Harunori Furuta, Masaki Omiya

研究成果: Article査読

41 被引用数 (Scopus)

抄録

The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.

本文言語English
ページ(範囲)1084-1088
ページ数5
ジャーナルSurface and Coatings Technology
202
4-7
DOI
出版ステータスPublished - 2007 12月 15
外部発表はい

ASJC Scopus subject areas

  • 化学 (全般)
  • 凝縮系物理学
  • 表面および界面
  • 表面、皮膜および薄膜
  • 材料化学

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