TY - GEN
T1 - An extension of a temperature modeling tool hotspot 6.0 for castle-of-chips stacking
AU - Totoki, Tomohiro
AU - Koibuchi, Michihiro
AU - Amano, Hideharu
PY - 2018/12/26
Y1 - 2018/12/26
N2 - HotSpot is an open source analysis tool for estimating temperature of both 2D and 3D chip stacks. It counts both the primary path of the heat transfer through the heat-sink and the secondary path through the print circuit board. It can estimate the temperature of chips. However, HotSpot-6.0 cannot treat a complicated chip stacking such as the castle of chips (CoC) with inductive wireless coupling through-chip interface (TCI). Therefore, in this report we have extended the HotSpot simulator and updated it in order to evaluate CoC. Compared to the original HotSpot, the extended version of HotSpot had an average execution time increase of about 6% when evaluating the same vertical stacking. The execution time of CoC with the same number of chips is shorter than when executing vertical stacking, but when the number of layers is the same, the execution time is almost equal. Moreover, our design considers high productivity, e.g. it can easily set air cooling, oil cooling, water cooling evaluation and chip rotation setting.
AB - HotSpot is an open source analysis tool for estimating temperature of both 2D and 3D chip stacks. It counts both the primary path of the heat transfer through the heat-sink and the secondary path through the print circuit board. It can estimate the temperature of chips. However, HotSpot-6.0 cannot treat a complicated chip stacking such as the castle of chips (CoC) with inductive wireless coupling through-chip interface (TCI). Therefore, in this report we have extended the HotSpot simulator and updated it in order to evaluate CoC. Compared to the original HotSpot, the extended version of HotSpot had an average execution time increase of about 6% when evaluating the same vertical stacking. The execution time of CoC with the same number of chips is shorter than when executing vertical stacking, but when the number of layers is the same, the execution time is almost equal. Moreover, our design considers high productivity, e.g. it can easily set air cooling, oil cooling, water cooling evaluation and chip rotation setting.
KW - 3D stacking
KW - HotSpot
KW - TCI
UR - http://www.scopus.com/inward/record.url?scp=85061456584&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85061456584&partnerID=8YFLogxK
U2 - 10.1109/CANDARW.2018.00073
DO - 10.1109/CANDARW.2018.00073
M3 - Conference contribution
AN - SCOPUS:85061456584
T3 - Proceedings - 2018 6th International Symposium on Computing and Networking Workshops, CANDARW 2018
SP - 363
EP - 369
BT - Proceedings - 2018 6th International Symposium on Computing and Networking Workshops, CANDARW 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Symposium on Computing and Networking Workshops, CANDARW 2018
Y2 - 27 November 2018 through 30 November 2018
ER -