An extension of a temperature modeling tool hotspot 6.0 for castle-of-chips stacking

Tomohiro Totoki, Michihiro Koibuchi, Hideharu Amano

研究成果: Conference contribution

抄録

HotSpot is an open source analysis tool for estimating temperature of both 2D and 3D chip stacks. It counts both the primary path of the heat transfer through the heat-sink and the secondary path through the print circuit board. It can estimate the temperature of chips. However, HotSpot-6.0 cannot treat a complicated chip stacking such as the castle of chips (CoC) with inductive wireless coupling through-chip interface (TCI). Therefore, in this report we have extended the HotSpot simulator and updated it in order to evaluate CoC. Compared to the original HotSpot, the extended version of HotSpot had an average execution time increase of about 6% when evaluating the same vertical stacking. The execution time of CoC with the same number of chips is shorter than when executing vertical stacking, but when the number of layers is the same, the execution time is almost equal. Moreover, our design considers high productivity, e.g. it can easily set air cooling, oil cooling, water cooling evaluation and chip rotation setting.

本文言語English
ホスト出版物のタイトルProceedings - 2018 6th International Symposium on Computing and Networking Workshops, CANDARW 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ363-369
ページ数7
ISBN(電子版)9781538691847
DOI
出版ステータスPublished - 2018 12月 26
イベント6th International Symposium on Computing and Networking Workshops, CANDARW 2018 - Takayama, Japan
継続期間: 2018 11月 272018 11月 30

出版物シリーズ

名前Proceedings - 2018 6th International Symposium on Computing and Networking Workshops, CANDARW 2018

Conference

Conference6th International Symposium on Computing and Networking Workshops, CANDARW 2018
国/地域Japan
CityTakayama
Period18/11/2718/11/30

ASJC Scopus subject areas

  • コンピュータ ネットワークおよび通信
  • ハードウェアとアーキテクチャ
  • 統計学、確率および不確実性
  • コンピュータ サイエンスの応用

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