An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe; Tetsuya Asai; Masafumi Mori; Toshiyuki Itou; Daisuke Uchida; Yasuhiro Take; Tadahiro Kuroda; Masato Motomura

doi:10.1109/ASPDAC.2017.7858275

An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

1,000 fps motion vector (MV) estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient MV estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.

本文言語	English
ホスト出版物のタイトル	2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	7-8
ページ数	2
ISBN（電子版）	9781509015580
DOI	https://doi.org/10.1109/ASPDAC.2017.7858275
出版ステータス	Published - 2017 2月 16
イベント	22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan 継続期間: 2017 1月 16 → 2017 1月 19

Other

Other	22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
国/地域	Japan
City	Chiba
Period	17/1/16 → 17/1/19

ASJC Scopus subject areas

電子工学および電気工学
コンピュータサイエンスの応用
コンピュータグラフィックスおよびコンピュータ支援設計

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10.1109/ASPDAC.2017.7858275

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引用スタイル

Ikebe, M., Asai, T., Mori, M., Itou, T., Uchida, D., Take, Y., Kuroda, T., & Motomura, M. (2017). An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 (pp. 7-8). [7858275] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2017.7858275

Ikebe, M, Asai, T, Mori, M, Itou, T, Uchida, D, Take, Y, Kuroda, T & Motomura, M 2017, An image sensor/processor 3D stacked module featuring ThruChip interfaces. in 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017., 7858275, Institute of Electrical and Electronics Engineers Inc., pp. 7-8, 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, 17/1/16. https://doi.org/10.1109/ASPDAC.2017.7858275

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An image sensor/processor 3D stacked module featuring ThruChip interfaces

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