An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips

Junichiro Kadomoto, Tomoki Miyata, Hideharu Amano, Tadahiro Kuroda

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

A wireless vertical bus with collision detection scheme for 3-D network-on-chips (NoC) is presented. Utilizing inductive-coupling between coils, wireless connection between all stacked chips is established. Data collision is detected by sensing magnetic field variation. A test chip is fabricated in 65 nm SOI CMOS technology. A data rate of 0.8 Gb/s with a BER < 10-12 is achieved. The energy efficiency is better than 1.4 pJ/b. A collision detection circuit is implemented and its operation is confirmed.

本文言語English
ホスト出版物のタイトル2016 IEEE Asian Solid-State Circuits Conference, A-SSCC 2016 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ41-44
ページ数4
ISBN(電子版)9781509037001
DOI
出版ステータスPublished - 2017 2 6
イベント12th IEEE Asian Solid-State Circuits Conference, A-SSCC 2016 - Toyama, Japan
継続期間: 2016 11 72016 11 9

Other

Other12th IEEE Asian Solid-State Circuits Conference, A-SSCC 2016
国/地域Japan
CityToyama
Period16/11/716/11/9

ASJC Scopus subject areas

  • 電子工学および電気工学
  • ハードウェアとアーキテクチャ

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