An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM

Kiichi Niitsu; Yasuhisa Shimazaki; Yasufumi Sugimori; Yoshinori Kohama; Kazutaka Kasuga; Itaru Nonomura; Makoto Saen; Shigenobu Komatsu; Kenichi Osada; Naohiko Irie; Toshihiro Hattori; Atsushi Hasegawa; Tadahiro Kuroda

doi:10.1109/ISSCC.2009.4977517

An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM

Kiichi Niitsu, Yasuhisa Shimazaki, Yasufumi Sugimori, Yoshinori Kohama, Kazutaka Kasuga, Itaru Nonomura, Makoto Saen, Shigenobu Komatsu, Kenichi Osada, Naohiko Irie, Toshihiro Hattori, Atsushi Hasegawa, Tadahiro Kuroda

研究成果: Conference contribution

57 被引用数 (Scopus)

本文言語	English
ホスト出版物のタイトル	2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	480-482
ページ数	3
ISBN（印刷版）	1424434580, 9781424434589
DOI	https://doi.org/10.1109/ISSCC.2009.4977517
出版ステータス	Published - 2009
イベント	2009 IEEE International Solid-State Circuits Conference ISSCC 2009 - San Francisco, CA, United States 継続期間: 2009 2月 8 → 2009 2月 12

出版物シリーズ

名前	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN（印刷版）	0193-6530

Other

Other	2009 IEEE International Solid-State Circuits Conference ISSCC 2009
国/地域	United States
City	San Francisco, CA
Period	09/2/8 → 09/2/12

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
電子工学および電気工学

文献へのアクセス

10.1109/ISSCC.2009.4977517

他のファイルとリンク

引用スタイル

Niitsu, K., Shimazaki, Y., Sugimori, Y., Kohama, Y., Kasuga, K., Nonomura, I., Saen, M., Komatsu, S., Osada, K., Irie, N., Hattori, T., Hasegawa, A., & Kuroda, T. (2009). An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009 (pp. 480-482). [4977517] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2009.4977517

An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. / Niitsu, Kiichi; Shimazaki, Yasuhisa; Sugimori, Yasufumi その他.

2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc., 2009. p. 480-482 4977517 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

研究成果: Conference contribution

Niitsu, K, Shimazaki, Y, Sugimori, Y, Kohama, Y, Kasuga, K, Nonomura, I, Saen, M, Komatsu, S, Osada, K, Irie, N, Hattori, T, Hasegawa, A & Kuroda, T 2009, An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. in 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009., 4977517, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Institute of Electrical and Electronics Engineers Inc., pp. 480-482, 2009 IEEE International Solid-State Circuits Conference ISSCC 2009, San Francisco, CA, United States, 09/2/8. https://doi.org/10.1109/ISSCC.2009.4977517

Niitsu K, Shimazaki Y, Sugimori Y, Kohama Y, Kasuga K, Nonomura I その他. An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. In 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc. 2009. p. 480-482. 4977517. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2009.4977517

Niitsu, Kiichi ; Shimazaki, Yasuhisa ; Sugimori, Yasufumi その他. / An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009. Institute of Electrical and Electronics Engineers Inc., 2009. pp. 480-482 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

@inproceedings{11ad8a25dd03486e84b7ce3ea9911e80,

title = "An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM",

author = "Kiichi Niitsu and Yasuhisa Shimazaki and Yasufumi Sugimori and Yoshinori Kohama and Kazutaka Kasuga and Itaru Nonomura and Makoto Saen and Shigenobu Komatsu and Kenichi Osada and Naohiko Irie and Toshihiro Hattori and Atsushi Hasegawa and Tadahiro Kuroda",

year = "2009",

doi = "10.1109/ISSCC.2009.4977517",

language = "English",

isbn = "1424434580",

series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "480--482",

booktitle = "2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009",

note = "2009 IEEE International Solid-State Circuits Conference ISSCC 2009 ; Conference date: 08-02-2009 Through 12-02-2009",

}

TY - GEN

T1 - An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM

AU - Niitsu, Kiichi

AU - Shimazaki, Yasuhisa

AU - Sugimori, Yasufumi

AU - Kohama, Yoshinori

AU - Kasuga, Kazutaka

AU - Nonomura, Itaru

AU - Saen, Makoto

AU - Komatsu, Shigenobu

AU - Osada, Kenichi

AU - Irie, Naohiko

AU - Hattori, Toshihiro

AU - Hasegawa, Atsushi

AU - Kuroda, Tadahiro

PY - 2009

Y1 - 2009

UR - http://www.scopus.com/inward/record.url?scp=70349291205&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70349291205&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2009.4977517

DO - 10.1109/ISSCC.2009.4977517

M3 - Conference contribution

AN - SCOPUS:70349291205

SN - 1424434580

SN - 9781424434589

T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

SP - 480

EP - 482

BT - 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2009

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2009 IEEE International Solid-State Circuits Conference ISSCC 2009

Y2 - 8 February 2009 through 12 February 2009

ER -