An MCM-D module using newly structured thermal management technique

Naoaki Yamanaka, A. Harada, K. Kaizu, T. Kawamura

研究成果: Conference contribution

抜粋

This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

元の言語English
ホスト出版物のタイトル2nd 1998 IEMT/IMC Symposium
出版者Institute of Electrical and Electronics Engineers Inc.
ページ255-260
ページ数6
1998-April
ISBN(電子版)0780350901, 9780780350908
DOI
出版物ステータスPublished - 1998 1 1
外部発表Yes
イベント2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998 - Tokyo, Japan
継続期間: 1998 4 151998 4 17

Other

Other2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998
Japan
Tokyo
期間98/4/1598/4/17

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Yamanaka, N., Harada, A., Kaizu, K., & Kawamura, T. (1998). An MCM-D module using newly structured thermal management technique. : 2nd 1998 IEMT/IMC Symposium (巻 1998-April, pp. 255-260). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMTIM.1998.704632