TY - GEN
T1 - An MRI-Compatible Force Sensor with Enclosed Air Using Pressure Transmission
AU - Akutagawa, Daiki
AU - Izumizaki, Tomohiko
AU - Hori, Masataka
AU - Takahashi, Hidetoshi
AU - Shimoyama, Isao
AU - Dohi, Tetsuji
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - We fabricated an MRI-compatible force sensor with enclosed air using pressure transmission. The fabricated force sensor consists of a contact portion, sensing portions, and connecting pipes. When force was applied to the contact portion, the internal air pressure increased with a deformation of the contact portion, and is transmitted to the sensing portion through the connecting pipes. In the sensing portion, the change in air pressure is detected by a change in the resistance of a piezoresistive cantilever. Since using this air pressure transmission, the sensing portion can be placed away from the magnet of the MRI. Therefore, the force sensor does not interfere with the magnetic field, and it can be used in the magnet of an MRI.
AB - We fabricated an MRI-compatible force sensor with enclosed air using pressure transmission. The fabricated force sensor consists of a contact portion, sensing portions, and connecting pipes. When force was applied to the contact portion, the internal air pressure increased with a deformation of the contact portion, and is transmitted to the sensing portion through the connecting pipes. In the sensing portion, the change in air pressure is detected by a change in the resistance of a piezoresistive cantilever. Since using this air pressure transmission, the sensing portion can be placed away from the magnet of the MRI. Therefore, the force sensor does not interfere with the magnetic field, and it can be used in the magnet of an MRI.
UR - http://www.scopus.com/inward/record.url?scp=85074356474&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2019.8870813
DO - 10.1109/MEMSYS.2019.8870813
M3 - Conference contribution
AN - SCOPUS:85074356474
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 803
EP - 806
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -