Analysis of Resistance Distribution and Voltage Drop in Chips with Inductive Coupling Wireless Communication Interface

Hideto Kayashima, Hideharu Amano

研究成果: Conference contribution

抄録

The building block computing system can build several systems by stacking small chips with inductive coupling wireless chip-to-chip connection TCI (Through Chip Interface). TCI IP (Intellectual Property) was developed by using the Renesas 65nm SOTB process, and several family chips have been developed with the IP. Although all of the chips worked alone without problems, when they were stacked to construct a system, problems were found on some combinations of chips that TCI did not work as designed. This paper analyzes the resistances of power grid of chips with IPs from their layout to investigate the reason of the problems. Then, the voltage drop is estimated with the model built from the real chip evaluation. The analysis results appeared that in some chips, the resistances of the power grid are more than double of the target value, and because of the voltage drop, the supply voltage given to the IP of the largest chip SMTT is about the half of given to the power pad. Although it comes from the limitation of the I/O pads for chip stacking and fixed location of TCI IPs, we must take special care of the design of the transmitter power grid.

本文言語English
ホスト出版物のタイトルProceedings - 2021 9th International Symposium on Computing and Networking Workshops, CANDARW 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ292-296
ページ数5
ISBN(電子版)9781665428354
DOI
出版ステータスPublished - 2021
イベント9th International Symposium on Computing and Networking Workshops, CANDARW 2021 - Virtual, Online, Japan
継続期間: 2021 11月 232021 11月 26

出版物シリーズ

名前Proceedings - 2021 9th International Symposium on Computing and Networking Workshops, CANDARW 2021

Conference

Conference9th International Symposium on Computing and Networking Workshops, CANDARW 2021
国/地域Japan
CityVirtual, Online
Period21/11/2321/11/26

ASJC Scopus subject areas

  • 人工知能
  • コンピュータ ネットワークおよび通信
  • 情報システム
  • ソフトウェア

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