Analytical thruchip inductive coupling channel design optimization

Li Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda

    研究成果: Conference contribution

    9 被引用数 (Scopus)

    抄録

    ThruChip interface (TCI) is an emerging 3-D integrated circuit stacking technology. TCI utilizes on-chip inductor to build vertical communication channel in near field distance and has been proved to stand comparison with through-siliconvia (TSV) in data rate, power, and reliability. Moreover, it is also cost-effective in manufacturing due to its wireless nature. In this paper, an analytical method is proposed to find near-optimal TCI inductive coupling channel solution. The experiment results show an average 16.8% transmitting current reduction and shrink design time from days to a few minutes.

    本文言語English
    ホスト出版物のタイトル2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ731-736
    ページ数6
    25-28-January-2016
    ISBN(電子版)9781467395694
    DOI
    出版ステータスPublished - 2016 3月 7
    イベント21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016 - Macao, Macao
    継続期間: 2016 1月 252016 1月 28

    Other

    Other21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
    国/地域Macao
    CityMacao
    Period16/1/2516/1/28

    ASJC Scopus subject areas

    • 電子工学および電気工学
    • コンピュータ サイエンスの応用
    • コンピュータ グラフィックスおよびコンピュータ支援設計

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