Anodic bonding for integrated capacitive sensors

M. Esashi, N. Ura, Y. Matsumoto

研究成果: Conference contribution

39 被引用数 (Scopus)

抄録

Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metalization, are noted.

本文言語English
ホスト出版物のタイトルProc IEEE Micro Electro Mech Syst Workshop
出版社Publ by IEEE
ページ43-48
ページ数6
ISBN(印刷版)0780304977, 9780780304970
DOI
出版ステータスPublished - 1992
外部発表はい
イベントProceedings of the IEEE Micro Electro Mechanical Systems Workshop - Travemuende, Ger
継続期間: 1992 2 41992 2 7

出版物シリーズ

名前Proc IEEE Micro Electro Mech Syst Workshop

Other

OtherProceedings of the IEEE Micro Electro Mechanical Systems Workshop
CityTravemuende, Ger
Period92/2/492/2/7

ASJC Scopus subject areas

  • 工学(全般)

フィンガープリント

「Anodic bonding for integrated capacitive sensors」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル