Anodic bonding for integrated capacitive sensors

M. Esashi, N. Ura, Y. Matsumoto

研究成果: Conference contribution

38 引用 (Scopus)

抜粋

Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metalization, are noted.

元の言語English
ホスト出版物のタイトルProc IEEE Micro Electro Mech Syst Workshop
出版者Publ by IEEE
ページ43-48
ページ数6
ISBN(印刷物)0780304977
出版物ステータスPublished - 1992 12 1
外部発表Yes
イベントProceedings of the IEEE Micro Electro Mechanical Systems Workshop - Travemuende, Ger
継続期間: 1992 2 41992 2 7

出版物シリーズ

名前Proc IEEE Micro Electro Mech Syst Workshop

Other

OtherProceedings of the IEEE Micro Electro Mechanical Systems Workshop
Travemuende, Ger
期間92/2/492/2/7

    フィンガープリント

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Esashi, M., Ura, N., & Matsumoto, Y. (1992). Anodic bonding for integrated capacitive sensors. : Proc IEEE Micro Electro Mech Syst Workshop (pp. 43-48). (Proc IEEE Micro Electro Mech Syst Workshop). Publ by IEEE.