Bonding energy of direct-bonded hydrophylic silicon wafers with nanoscale surface roughness at room temperature

Norihisa Miki, S. M. Spearing

研究成果: Conference contribution

抜粋

Silicon-direct wafer bonding is a promising technology for manufacturing three-dimensional complex MEMS structures as well as SOI substrates. Amongst the various contributors to the bond quality, surface roughness at nanoscale plays a vital role. However, the effect of surface roughness on direct-bond quality has not been quantified. We conducted bonding experiments on silicon wafers with various surface roughness generated by chemical treatment. The bond quality was evaluated by measurement of the bonding energy. The surface roughness investigated by atomic force microscopy was directly correlated to the bond quality for the first time by means of the bearing ratio, which represents the ratio of the surface area lying above a given depth. The bearing ratio discussed herein is an appropriate criterion for the surface quality of silicon wafers to be direct-bonded.

元の言語English
ホスト出版物のタイトルTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1311-1314
ページ数4
2
ISBN(印刷物)0780377311, 9780780377318
DOI
出版物ステータスPublished - 2003
外部発表Yes
イベント12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
継続期間: 2003 6 82003 6 12

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
United States
Boston
期間03/6/803/6/12

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

これを引用

Miki, N., & Spearing, S. M. (2003). Bonding energy of direct-bonded hydrophylic silicon wafers with nanoscale surface roughness at room temperature. : TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers (巻 2, pp. 1311-1314). [1217014] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSOR.2003.1217014