Carbon nanotube bumps for LSI interconnect

Ikuo Soga, Daiyu Kondo, Yoshitaka Yamaguchi, Taisuke Iwai, Masataka Mizukoshi, Yuji Awano, Kunio Yube, Takashi Fujii

研究成果: Conference contribution

47 引用 (Scopus)

抜粋

We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle of multi-walled CNTs. Resilient and flexible CNT bumps make flip chip LSI modules resistant to thermal stress. Furthermore, CNT bumps have a low electrical resistance and robustness over electromigration. In the experiment, the CNT bumps were used to connect a test evaluation group (TEG) chip and a host substrate, and their electrical resistance was evaluated. We found that the electrical contacts of CNT bumps with the chip and the substrate are important. For a good electrical contact, the CNT bumps were coated with gold and fixed to the chip and substrate. The resultant CNT bump with a diameter of 170 μm and a height of 100 μm exhibited a low resistance of 2.3 Ω. We then evaluated the flexibility of CNT bumps by pressing the TEG chip and measuring the displacement. The displacement between the TEG chip and host substrate was 10-20 % of the bump height, demonstrating an excellent flexibility.

元の言語English
ホスト出版物のタイトル2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
ページ1390-1394
ページ数5
DOI
出版物ステータスPublished - 2008 9 15
外部発表Yes
イベント2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
継続期間: 2008 5 272008 5 30

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷物)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
United States
Lake Buena Vista, FL
期間08/5/2708/5/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Soga, I., Kondo, D., Yamaguchi, Y., Iwai, T., Mizukoshi, M., Awano, Y., Yube, K., & Fujii, T. (2008). Carbon nanotube bumps for LSI interconnect. : 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 1390-1394). [4550158] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550158