Carbon nanotube bumps for thermal and electric conduction in transistor

Taisuke Iwai, Yuji Awano

研究成果: Article査読

13 被引用数 (Scopus)

抄録

The continuous miniaturization of semiconductor chips has rapidly improved the performance of semiconductor products. However, thermal issues that affect semiconductor chips are becoming more serious. For example, heat transfer has become a very serious problem in the CPUs of personal computers; high-frequency high-power amplifiers (HPAs) of mobile communication systems; and power control units of hybrid-car motors. To solve this problem, Fujitsu has been developing semiconductor heat sinks that exploit the high thermal conductivity of carbon nanotubes (CNTs). This paper describes the CNT bumps we have recently developed for transferring heat and electrically connecting the source, gate, and drain of the high-power, flip-chip amplifiers of mobile communication base stations. CNT bumps can be used to achieve high gain and high thermal conductivity in high-frequency HPAs. This paper introduces some recent developments in CNT bump technology.

本文言語English
ページ(範囲)508-515
ページ数8
ジャーナルFujitsu Scientific and Technical Journal
43
4
出版ステータスPublished - 2007 10
外部発表はい

ASJC Scopus subject areas

  • 人間とコンピュータの相互作用
  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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