Carbon nanotube vias for future LSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

研究成果: Conference contribution

65 被引用数 (Scopus)

抄録

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

本文言語English
ホスト出版物のタイトルProceedings of the IEEE 2004 International Interconnect Technology Conference
ページ251-253
ページ数3
出版ステータスPublished - 2004 11月 25
外部発表はい
イベントProceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States
継続期間: 2004 6月 72004 6月 9

出版物シリーズ

名前Proceedings of the IEEE 2004 International Interconnect Technology Conference

Other

OtherProceedings of the IEEE 2004 International Interconnect Technology Conference
国/地域United States
CityBurlingame, CA
Period04/6/704/6/9

ASJC Scopus subject areas

  • 工学(全般)

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