Carbon nanotubes (CNTs) exhibit excellent electrical properties that include a long mean free path, a high current-carrying capability and high thermal conductivity. Because of these factors, with their low electrical resistance and large electromigration tolerance, CNTs have been expected for use as aggressively scaled interconnects for next-generation LSIs. We report our trials of using CNT bundles as vertical interconnects, such as contact plugs on CMOS and vias on Cu wire.
ASJC Scopus subject areas
- Materials Science(all)