Castle of chips: A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

The number of stacked chips with wireless inductive coupling interconnect is limited by the physical space for bonding wires of supply voltage. A new chip stacking structure called CoC (Castle on Chips) is proposed for stacking a large number of chips without chip-to-chip wired interconnection. In the CoC, each chip has at least two sets of inductors, and is stacked on two chips in the lower layer shifting in the half chip size. Each chip takes a role of bridge of two chips in the lower layer and two in the upper layer. As examples of the CoC, the linear structure and circular structure are proposed. They form stairway boundary mesh structure, and a simple extension of Dimension Order Routing (DOR) can be deadlock free. The average distance of stairway boundary mesh is better than that of rectangular mesh, and sometimes comparable that of squire mesh. The circular stacking is advantageous when the number of stacking layers is strictly limited.

本文言語English
ホスト出版物のタイトルProceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012
ページ820-825
ページ数6
DOI
出版ステータスPublished - 2012 12 14
イベント2012 15th International Conference on Network-Based Information Systems, NBIS 2012 - Melbourne, VIC, Australia
継続期間: 2012 9 262012 9 28

出版物シリーズ

名前Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012

Other

Other2012 15th International Conference on Network-Based Information Systems, NBIS 2012
国/地域Australia
CityMelbourne, VIC
Period12/9/2612/9/28

ASJC Scopus subject areas

  • コンピュータ ネットワークおよび通信
  • 情報システム

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