Chip morphology of ultra-precision diamond turning of single crystal silicon

Jiwang Yan, Katsuo Syoji, Tsunemoto Kuriyagawa

研究成果: Article査読

16 被引用数 (Scopus)

抄録

Material removal behavior of single crystal silicon in ultra-precision diamond turning is experimentally studied. Microscopic chip morphology is investigated to clarify the brittle-ductile transition mechanism. A straight-nosed diamond tool is used to obtain the uniform chip thickness along the cutting edge. Three dominant types of chips are observed under different undeformed chip thickness. In the brittle regime, irregular grain chips and pitted surface are formed by cleavage fracture. As an intermediate regime, periodical shear deformation occurs with producing line chips and striated surface. The chip formation phenomenon in the ductile regime is confirmed to be similar to that of metal cutting, where continuous ribbon chips and perfectly transcribed surface can be obtained. Moreover, the crystallographic anisotropy effects in the chip morphology are found.

本文言語English
ページ(範囲)1008-1012
ページ数5
ジャーナルSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
65
7
DOI
出版ステータスPublished - 1999
外部発表はい

ASJC Scopus subject areas

  • Mechanical Engineering

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