Damage free dicing method for MEMS devices

Y. Awatani, Yoshinori Matsumoto, K. Kato

研究成果: Conference contribution

8 引用 (Scopus)

抜粋

A damage free dicing method for MEMS devices has been researched in this paper. The method is based on the bonding and detachment of a glass plate cap by using a thermoplastic adhesive. The sand blast technique was used for fabrication of the glass cap wafer, which has concavities with depth of 100 μm. The thermoplastic adhesive (STAYSTIK373, Techno Alpha Co. Ltd.) was screen printed on the glass cap wafer. The glass cap wafer was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips. The glass cap plate was easily detached at 300°C. This method prevented MEMS devices from suffering contamination by water or dicing dust during the dicing process. The method is easily applied to current mass-production processes, because the method is accomplished with inexpensive materials and well-established equipment. The process conditions and examples have been explained in the paper.

元の言語English
ホスト出版物のタイトル2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest
出版者Institute of Electrical and Electronics Engineers Inc.
ページ137-138
ページ数2
ISBN(電子版)0780375955, 9780780375956
DOI
出版物ステータスPublished - 2002
イベントIEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Lugano, Switzerland
継続期間: 2002 8 202002 8 23

Other

OtherIEEE/LEOS International Conference on Optical MEMs, OMEMS 2002
Switzerland
Lugano
期間02/8/2002/8/23

    フィンガープリント

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Awatani, Y., Matsumoto, Y., & Kato, K. (2002). Damage free dicing method for MEMS devices. : 2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest (pp. 137-138). [1031481] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OMEMS.2002.1031481