Damage Free Dicing Method for MEMS Devices

Yoshinori Matsumoto, Yoshio Awatani, Kei Kato

研究成果: Article査読

2 被引用数 (Scopus)

抄録

This paper presents a dicing method for MEMS devices without dameges during the dicing process. The method is based on bonding and detachment of a glass cap plate by using thermoplastic adhesive. Sand blast technique was used for the fabrication of glass cap plate which has concavities in the depth of 100^m. The thermoplastic adhesive was screen printed on the glass plate. The plate was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips without damages from water or dicing dusts. The chip was mounted in the package while the glass cap was removed at 330C.

本文言語English
ページ(範囲)255-256
ページ数2
ジャーナルieej transactions on sensors and micromachines
123
7
DOI
出版ステータスPublished - 2003

ASJC Scopus subject areas

  • 機械工学
  • 電子工学および電気工学

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