Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge

H. Kobayashi, H. Kakiuchi, K. Yasutake, T. Suzuki, M. Noborisaka, N. Negishi

研究成果: Conference article査読

1 被引用数 (Scopus)

抄録

A novel roll-to-roll deposition method, namely, "through-substrate plane-plate dielectric-barrier discharge," was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.

本文言語English
論文番号012024
ジャーナルJournal of Physics: Conference Series
441
1
DOI
出版ステータスPublished - 2013
イベント11th Asia Pacific Conference on Plasma Science and Technology, APCPST 2012 and 25th Symposium on Plasma Science for Materials, SPSM 2012 - Kyoto, Japan
継続期間: 2012 10 22012 10 5

ASJC Scopus subject areas

  • 物理学および天文学(全般)

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