Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering