Deposition of Through-Hole Metal Film on Glass with Electroless Plating

Fumio Nakamaru, Yoshinori Matsumoto

研究成果: Article査読

抄録

Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.

本文言語English
ページ(範囲)313-314
ページ数2
ジャーナルieej transactions on sensors and micromachines
123
8
DOI
出版ステータスPublished - 2003

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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