Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo

Mao Mukaida, Jiwang Yan

研究成果: Article査読

68 被引用数 (Scopus)

抄録

Microlens arrays of single-crystal silicon are required increasingly in advanced IR optics. In this study, we attempted to machine spherical concave microlens arrays on a single-crystal silicon wafer by slow tool servo diamond turning. The form error, surface topography, material phase transformation, and cutting force characteristics were investigated experimentally. It was found that brittle fracture occurred preferentially at one side (the exit side of tool feed) of the lens dimples when cutting direction is along <110> and tool feed rate is high. Amorphous silicon phase was generated significantly at one side (the exit side of tool feed) of the dimples as tool feed rate increased. The peak values and the direction angles of cutting forces changed with tool feed rate, crystal orientation, and the cutting direction. Two kinds of tool wear, namely, micro chippings and flank wear were observed in different regions of the tool edge where undeformed chip thickness is different. Spherical microlens arrays with a form error of ~300 nmPV and surface roughness of ~6 nmSa were successfully fabricated.

本文言語English
ページ(範囲)2-14
ページ数13
ジャーナルInternational Journal of Machine Tools and Manufacture
115
DOI
出版ステータスPublished - 2017 4 1

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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