Dynamic stressing measurement of viscous liquids using microfluidic chips

Z. G. Li, C. D. Oh, K. Ando, J. B. Zhang, A. Q. Liu

研究成果: Conference contribution

抜粋

This paper demonstrates the dynamic stressing of viscous liquids in microfluidic channels. An infrared laser pulse is focused within the testing liquid in a microfluidic channel and a spherical shock wave near an air-liquid interface is created. The shock is reflected as a tension wave by the free surface due to the acoustic impedance mismatch. The displacement of the free surface within hundred nanoseconds is captured by a developed double-exposure optical system. The tensile strength can be estimated by extrapolating a series of shock pressure approximation at several different distances between the bubble and the free surface to the measurement accuracy. This study has a great potential in the optical breakdown of biomaterials.

元の言語English
ホスト出版物のタイトルIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
ページ1137-1140
ページ数4
DOI
出版物ステータスPublished - 2013 4 2
イベントIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
継続期間: 2013 1 202013 1 24

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷物)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Taiwan, Province of China
Taipei
期間13/1/2013/1/24

    フィンガープリント

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

これを引用

Li, Z. G., Oh, C. D., Ando, K., Zhang, J. B., & Liu, A. Q. (2013). Dynamic stressing measurement of viscous liquids using microfluidic chips. : IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 (pp. 1137-1140). [6474451] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2013.6474451