Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices

X. Kang, J. Tamaki, A. Kubo, J. Yan, T. Iyama

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.

元の言語English
ホスト出版物のタイトルAdvances in Abrasive Technology VIII
出版者Trans Tech Publications Ltd
ページ139-144
ページ数6
ISBN(印刷物)9780878499748
DOI
出版物ステータスPublished - 2005 1 1
外部発表Yes
イベント8th International Symposium on Advances in Abrasive Technology, ISAAT 2005 - St. Petersburg, Russian Federation
継続期間: 2005 5 202005 5 24

出版物シリーズ

名前Key Engineering Materials
291-292
ISSN(印刷物)1013-9826
ISSN(電子版)1662-9795

Conference

Conference8th International Symposium on Advances in Abrasive Technology, ISAAT 2005
Russian Federation
St. Petersburg
期間05/5/2005/5/24

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • これを引用

    Kang, X., Tamaki, J., Kubo, A., Yan, J., & Iyama, T. (2005). Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices. : Advances in Abrasive Technology VIII (pp. 139-144). (Key Engineering Materials; 巻数 291-292). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.291-292.139