TY - JOUR
T1 - Effect of indium substitution on the thermoelectric properties of orthorhombic Cu4SnS4
AU - Goto, Yosuke
AU - Kamihara, Yoichi
AU - Matoba, Masanori
N1 - Funding Information:
This work was partially supported by research grants from Keio University, the Keio Leading-edge Laboratory of Science and Technology (KLL), and the Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST) from the Japan Society for Promotion of Science (JSPS).
PY - 2014/6
Y1 - 2014/6
N2 - We report the thermoelectric properties of Cu4In x Sn1-x S4 (x = 0-0.02), which undergoes a first-order structural phase transition at ∼230 K. Substitution of In3+ for Sn4+ suppresses the phase transition temperature (T t). Indium substitution reduces the electrical resistivity, and degenerate conduction by the orthorhombic phase is observed. The Seebeck coefficient increases over the whole temperature range and a maximum value occurs in the monoclinic phase as a result of indium substitution. Thermal conductivity decreases as x increases, which enhances the dimensionless figure of merit, ZT. We therefore expect optimization of the chemical composition of indium-doped Cu4SnS4 to result in an even larger ZT value.
AB - We report the thermoelectric properties of Cu4In x Sn1-x S4 (x = 0-0.02), which undergoes a first-order structural phase transition at ∼230 K. Substitution of In3+ for Sn4+ suppresses the phase transition temperature (T t). Indium substitution reduces the electrical resistivity, and degenerate conduction by the orthorhombic phase is observed. The Seebeck coefficient increases over the whole temperature range and a maximum value occurs in the monoclinic phase as a result of indium substitution. Thermal conductivity decreases as x increases, which enhances the dimensionless figure of merit, ZT. We therefore expect optimization of the chemical composition of indium-doped Cu4SnS4 to result in an even larger ZT value.
KW - Thermoelectric material
KW - copper sulfide
KW - first-order phase transition
UR - http://www.scopus.com/inward/record.url?scp=84901935638&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84901935638&partnerID=8YFLogxK
U2 - 10.1007/s11664-014-3007-7
DO - 10.1007/s11664-014-3007-7
M3 - Article
AN - SCOPUS:84901935638
SN - 0361-5235
VL - 43
SP - 2202
EP - 2205
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 6
ER -