Effect of intermetallic compound layer development on interfacial strength of solder joints

Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya, Masazumi Amagai

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Recently, preventing environmental pollutions, lead-free (Pb-free) solders are widely used instead of conventional lead-tin(Pb-Sn) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and Pb-free solders (Sn-Ag-Cu solders), the specimen of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relations between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were also examined.

本文言語English
ホスト出版物のタイトルAdvances in Electronic Packaging; Thermal Manegement Reliability
ページ1157-1164
ページ数8
出版ステータスPublished - 2001 12 1
外部発表はい
イベントPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
継続期間: 2001 7 82001 7 13

出版物シリーズ

名前Advances in Electronic Packaging
2

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
国/地域United States
CityKauai, Hi
Period01/7/801/7/13

ASJC Scopus subject areas

  • 工学(全般)
  • 電子工学および電気工学

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