Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide

Takumi Yamamoto; Yasutomo Ota; Satomi Ishida; Naoto Kumagai; Satoshi Iwamoto; Yasuhiko Arakawa

doi:10.1109/MOC.2015.7416502

Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide

Takumi Yamamoto, Yasutomo Ota, Satomi Ishida, Naoto Kumagai, Satoshi Iwamoto, Yasuhiko Arakawa

研究成果: Conference contribution

抄録

We measured the emission decay rates of self-assembled InAs single quantum dots (QDs) embedded in subwavelength-width semiconductor waveguides with and without Au side claddings. The Au claddings increased the decay rate of single QDs by ∼2 times, which is consistent with numerical simulations taking account of fabrication imperfection.

本文言語	English
ホスト出版物のタイトル	MOC 2015 - Technical Digest of 20th Microoptics Conference
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子版）	9784863485433
DOI	https://doi.org/10.1109/MOC.2015.7416502
出版ステータス	Published - 2016 2月 23
外部発表	はい
イベント	20th Microoptics Conference, MOC 2015 - Fukuoka, Japan 継続期間: 2015 10月 25 → 2015 10月 28

出版物シリーズ

名前	MOC 2015 - Technical Digest of 20th Microoptics Conference

Other

Other	20th Microoptics Conference, MOC 2015
国/地域	Japan
City	Fukuoka
Period	15/10/25 → 15/10/28

ASJC Scopus subject areas

原子分子物理学および光学
電子材料、光学材料、および磁性材料

文献へのアクセス

10.1109/MOC.2015.7416502

他のファイルとリンク

フィンガープリント

「Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Yamamoto, T., Ota, Y., Ishida, S., Kumagai, N., Iwamoto, S., & Arakawa, Y. (2016). Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide. In MOC 2015 - Technical Digest of 20th Microoptics Conference [7416502] (MOC 2015 - Technical Digest of 20th Microoptics Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MOC.2015.7416502

Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide. / Yamamoto, Takumi; Ota, Yasutomo; Ishida, Satomi その他.
MOC 2015 - Technical Digest of 20th Microoptics Conference. Institute of Electrical and Electronics Engineers Inc., 2016. 7416502 (MOC 2015 - Technical Digest of 20th Microoptics Conference).

研究成果: Conference contribution

Yamamoto, T, Ota, Y, Ishida, S, Kumagai, N, Iwamoto, S & Arakawa, Y 2016, Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide. in MOC 2015 - Technical Digest of 20th Microoptics Conference., 7416502, MOC 2015 - Technical Digest of 20th Microoptics Conference, Institute of Electrical and Electronics Engineers Inc., 20th Microoptics Conference, MOC 2015, Fukuoka, Japan, 15/10/25. https://doi.org/10.1109/MOC.2015.7416502

Yamamoto T, Ota Y, Ishida S, Kumagai N, Iwamoto S, Arakawa Y. Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide. In MOC 2015 - Technical Digest of 20th Microoptics Conference. Institute of Electrical and Electronics Engineers Inc. 2016. 7416502. (MOC 2015 - Technical Digest of 20th Microoptics Conference). doi: 10.1109/MOC.2015.7416502

Yamamoto, Takumi ; Ota, Yasutomo ; Ishida, Satomi その他. / Effect of metal side claddings on emission decay rate of single quantum dots embedded in a subwavelength semiconductor waveguide. MOC 2015 - Technical Digest of 20th Microoptics Conference. Institute of Electrical and Electronics Engineers Inc., 2016. (MOC 2015 - Technical Digest of 20th Microoptics Conference).

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abstract = "We measured the emission decay rates of self-assembled InAs single quantum dots (QDs) embedded in subwavelength-width semiconductor waveguides with and without Au side claddings. The Au claddings increased the decay rate of single QDs by ∼2 times, which is consistent with numerical simulations taking account of fabrication imperfection.",

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