Effects of target compliance on a high-speed droplet impact

Toshiyuki Sanada, Keita Ando, Tim Colonius

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

High speed spray cleaning which utilize droplets impact has been used for removing contaminants from wafer surface. When a droplet impacts a solid surface at high speed, the contact periphery expands very quickly and liquid compressibility plays an important role in the initial dynamics and the formation of lateral jets. Impact results in high pressures that can clean or damage the surface. In this study, we numerically investigated a high speed droplet impacts on a solid wall. In order to compare the available theory and experiments, 1D, 2D and axisymmetric solutions are obtained. The generated pressures, shock speeds, and the lateral jetting mechanism are investigated; especially the effect of target compliance is focused.

本文言語English
ホスト出版物のタイトルUltra Clean Processing of Semiconductor Surfaces X
出版社Trans Tech Publications Ltd
ページ137-140
ページ数4
ISBN(印刷版)9783037853887
DOI
出版ステータスPublished - 2012
外部発表はい
イベント10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2010 - Ostend, Belgium
継続期間: 2010 9 202010 9 22

出版物シリーズ

名前Solid State Phenomena
187
ISSN(印刷版)1012-0394

Other

Other10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2010
国/地域Belgium
CityOstend
Period10/9/2010/9/22

ASJC Scopus subject areas

  • 原子分子物理学および光学
  • 材料科学(全般)
  • 凝縮系物理学

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