Electroencephalogram Measurement in Adapting Process to Inverse Vision

T. Onomoto, Y. Yoshida, N. Miki

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper describes investigation of the brain activity in an adapting process to inversion vision through electroencephalogram (EEG). In particular, we used Candle-like microneedle electrodes, which does not require any preparation for measuring high-quality EEG. Note that conventional wet electrodes require abrasion of stratum corneum and application of electrolyte paste as preparation for measurement of EEG and they give discomfort to subjects and take time for experimenters. In our previous study, the eye movement during the adapting process was measured and the progress of the process was successfully captured. In this study, we measured EEG during the pointing task under an inverse vision state to correlate the perceptual learning with EEG. We discovered that High β wave, Low γ wave and Mid γ wave had strong correlation with the process of adapting to inversed vision.

本文言語English
ホスト出版物のタイトル2019 International Conference on Electronics Packaging, ICEP 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ134-137
ページ数4
ISBN(電子版)9784990218867
DOI
出版ステータスPublished - 2019 4
イベント2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
継続期間: 2019 4 172019 4 20

出版物シリーズ

名前2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
国/地域Japan
CityNiigata
Period19/4/1719/4/20

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 金属および合金

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