Enhancement of rotordynamic performance of high-speed micro-rotors for power MEMS applications by precision deep reactive ion etching

N. Miki, C. J. Teo, L. C. Ho, X. Zhang

研究成果: Article査読

16 被引用数 (Scopus)

抄録

High-precision fabrication is indispensable for high-speed silicon micro-rotors for power MEMS applications so as to minimize the rotor imbalance that deteriorates the rotor performance. Etch variation of deep reactive ion etch (DRIE) process results in differences in rotor blade heights and thus rotor imbalance. A Fourier transform of the etch non-uniformity along the rotor circumference revealed the global etch variation across the wafer and local variations in etch rates depending on the concentration or proximity of the patterned geometry. Rotor imbalance arising from the global etch variation of DRIE process was estimated, which compared favorably to results obtained from spinning experiments. The global etch non-uniformity which culminates in rotor imbalance could be alleviated to 0.25% across a rotor of 4.2 mm diameter by optimizing the plasma chamber pressure. The developed DRIE recipe successfully reduced the rotor imbalance and thus enhanced the rotordynamic performance. The manufacturing processes presented herein are readily applicable to the construction of other microstructures containing intricate geometries and large etched areas.

本文言語English
ページ(範囲)263-267
ページ数5
ジャーナルSensors and Actuators, A: Physical
104
3
DOI
出版ステータスPublished - 2003 5 15
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 金属および合金
  • 電子工学および電気工学

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