Evaluating the viscoelastic properties of glass above transition temperature for numerical modeling of lens molding process

Zhou Tianfeng, Yan Jiwang, Tsunemoto Kuriyagawa

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

Glass molding process has emerged as a promising way to produce complex optical elements with high precision. Glass material shows explicit viscoelasticity at molding temperature, therefore studying the viscoelastic properties of glass at elevated temperature is important for the molding process. In this paper, Young's modulus and viscosity of glass were tested by compressing cylindrical glass gobs above the transition temperature, and obtained by curve fitting using the Burgers model of viscoelastic deformation. Based on the viscoelastic parameters obtained from experiments, a numerical model was developed to simulate the glass molding process with the help of a commercial finite element method software package. The simulation results provide an easy way to analyze and understand the molding process in detail, such as temperature distribution, stress, strain and strain rate, which are difficult or impossible to measure in experiments. A good agreement between the calculated pressing loads and the experimental results verified the validity of the numerical model, which can be applied to predict the pressing load during complex-shape glass lens molding process.

本文言語English
ホスト出版物のタイトルInternational Symposium on Photoelectronic Detection and Imaging 2007
ホスト出版物のサブタイトルOptoelectronic System Design, Manufacturing, and Testing
DOI
出版ステータスPublished - 2008 3月 31
外部発表はい
イベントInternational Symposium on Photoelectronic Detection and Imaging, ISPDI 2007: Optoelectronic System Design, Manufacturing, and Testings - Beijing, China
継続期間: 2007 9月 92007 9月 12

出版物シリーズ

名前Proceedings of SPIE - The International Society for Optical Engineering
6624
ISSN(印刷版)0277-786X

Other

OtherInternational Symposium on Photoelectronic Detection and Imaging, ISPDI 2007: Optoelectronic System Design, Manufacturing, and Testings
国/地域China
CityBeijing
Period07/9/907/9/12

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • コンピュータ サイエンスの応用
  • 応用数学
  • 電子工学および電気工学

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