Evaluation of fatigue strength for solder joints after thermal aging

Takeshi Miyazaki, Masaki Oomiya, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

本文言語English
ホスト出版物のタイトルProceedings - EMAP 2005
ホスト出版物のサブタイトル2005 International Symposium on Electronics Materials and Packaging
ページ215-219
ページ数5
DOI
出版ステータスPublished - 2005 12 1
外部発表はい
イベントEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
継続期間: 2005 12 112005 12 14

出版物シリーズ

名前Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
国/地域Japan
CityTokyo
Period05/12/1105/12/14

ASJC Scopus subject areas

  • 工学(全般)

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