TY - GEN
T1 - Evaluation of fatigue strength for solder joints after thermal aging
AU - Miyazaki, Takeshi
AU - Oomiya, Masaki
AU - Inoue, Hirotsugu
AU - Kishimoto, Kikuo
AU - Amagai, Masazumi
PY - 2005/12/1
Y1 - 2005/12/1
N2 - Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.
AB - Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.
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U2 - 10.1109/EMAP.2005.1598264
DO - 10.1109/EMAP.2005.1598264
M3 - Conference contribution
AN - SCOPUS:33847279287
SN - 1424401070
SN - 9781424401079
T3 - Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
SP - 215
EP - 219
BT - Proceedings - EMAP 2005
T2 - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Y2 - 11 December 2005 through 14 December 2005
ER -