Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor

Taiyu Okatani, Hidetoshi Takahashi, Tomoyuki Takahata, Isao Shimoyama

研究成果: Conference contribution

2 引用 (Scopus)

抄録

This paper reports on a method to evaluate ground slippery condition using a MEMS slip sensor. The sensor discriminates between ground slippery and non-slippery conditions during walking motions of a bipedal robot, which enables the robot to prevent a slip. First, we evaluated the responses of the sensor pressed against an oiled or non-oiled surface. Then, we proposed a discriminating method between the oiled and non-oiled surfaces using the sensor. Finally, we demonstrated that a bipedal robot was able to evaluate the slippery condition of the ground where the foot of the robot landed during walk.

元の言語English
ホスト出版物のタイトル2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1033-1035
ページ数3
ISBN(電子版)9781509050789
DOI
出版物ステータスPublished - 2017 2 23
外部発表Yes
イベント30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
継続期間: 2017 1 222017 1 26

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷物)1084-6999

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
United States
Las Vegas
期間17/1/2217/1/26

Fingerprint

robots
microelectromechanical systems
MEMS
slip
Robots
evaluation
sensors
Sensors
walking

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

これを引用

Okatani, T., Takahashi, H., Takahata, T., & Shimoyama, I. (2017). Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. : 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 1033-1035). [7863588] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863588

Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. / Okatani, Taiyu; Takahashi, Hidetoshi; Takahata, Tomoyuki; Shimoyama, Isao.

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1033-1035 7863588 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

研究成果: Conference contribution

Okatani, T, Takahashi, H, Takahata, T & Shimoyama, I 2017, Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. : 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017., 7863588, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 1033-1035, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, Las Vegas, United States, 17/1/22. https://doi.org/10.1109/MEMSYS.2017.7863588
Okatani T, Takahashi H, Takahata T, Shimoyama I. Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. : 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1033-1035. 7863588. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2017.7863588
Okatani, Taiyu ; Takahashi, Hidetoshi ; Takahata, Tomoyuki ; Shimoyama, Isao. / Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1033-1035 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).
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