TY - GEN
T1 - Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead
AU - Peiris, Roshan Lalintha
AU - Peng, Wei
AU - Chen, Zikun
AU - Minamizawa, Kouta
N1 - Publisher Copyright:
© 2017 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/7/21
Y1 - 2017/7/21
N2 - Haptic feedback systems for spatial awareness are widely used in navigational and obstacle detection tasks and mostly used in combination with vibrotactile modules. As such, this work explores using thermal haptic feedback on the forehead for spatial awareness. As an initial step in this direction, our goal is to investigate the performance of different cueing methods for a minimal number of thermal elements. As such, the system uses three equally distributed peltier modules on the forehead to provide the thermal feedback. We investigated three different cuing methods with 30, 150 and 450 effective haptic feedback ranges. The results indicate that the 30 method to be the most precise (lowest error) while the 450 method to be the fastest for detecting the target.
AB - Haptic feedback systems for spatial awareness are widely used in navigational and obstacle detection tasks and mostly used in combination with vibrotactile modules. As such, this work explores using thermal haptic feedback on the forehead for spatial awareness. As an initial step in this direction, our goal is to investigate the performance of different cueing methods for a minimal number of thermal elements. As such, the system uses three equally distributed peltier modules on the forehead to provide the thermal feedback. We investigated three different cuing methods with 30, 150 and 450 effective haptic feedback ranges. The results indicate that the 30 method to be the most precise (lowest error) while the 450 method to be the fastest for detecting the target.
UR - http://www.scopus.com/inward/record.url?scp=85034262669&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85034262669&partnerID=8YFLogxK
U2 - 10.1109/WHC.2017.7989935
DO - 10.1109/WHC.2017.7989935
M3 - Conference contribution
AN - SCOPUS:85034262669
T3 - 2017 IEEE World Haptics Conference, WHC 2017
SP - 400
EP - 405
BT - 2017 IEEE World Haptics Conference, WHC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE World Haptics Conference, WHC 2017
Y2 - 6 June 2017 through 9 June 2017
ER -